ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,670, issued on Sept. 22, was assigned to ELTA SYSTEMS LTD. (Lod, Israel). "Encapsulation techniques" was invented by Itzhak Shapir (Haifa,... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,671, issued on Sept. 22, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device having first and second organi... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,672, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with inte... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,673, issued on Sept. 22, was assigned to Shanghai Tianma Micro-Electronics Co. Ltd. (Shanghai). "LED module, LED source substrate, display... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,674, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a plurality o... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,675, issued on Sept. 22, was assigned to ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "Memory module with reduced bonding wires" was invented ... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,676, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Substrate for semiconductor package and se... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,677, issued on Sept. 22, was assigned to Bridgelux Inc. (Fremont, Calif.). "Color-temperature-tunable lighting devices" was invented by Ji... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,678, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Min... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,679, issued on Sept. 22, was assigned to KYOCERA AVX Components Corp. (Fountain Inn, S.C.). "Package-on-package assembly containing a deco... Read More